Alpha Precision, Inc. specializes in ultrasonic drilling and machining of wafers for semi-conductor and MEMS applications. They do production quantities of 150 mm diameter BoroFloat wafers at .254 mm thickness and have made wafers as thin as .170 mm. They also offer MicroBlast technology which uses photolithography and dry etching to machine unique patterns onto glass wafers. This process will complement Alpha’s ultrasonic drilling expertise. MicroBlast will allow Alpha to produce smaller holes, channels, denser patterns, different shapes and hold tighter tolerances on thin glass wafers. Some of the new features offered are racetracks, ovals and crosses.
They use a quality management system conforming to ISO/TS 16949:2002 requirements. Alpha Precision, Inc. has a management team with over 76 years of combined experience in the glass and ceramics industry.
Special capabilities include: precision ultrasonic & microblast machining for MEMS
High Precision Machining
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